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The silicon wafer for semiconductor devices production is typically 200 to 300 mm in diameter and is divided into a number of dies, with each die having a same pattern which is used for manufacture of semiconductor chips. When dies are cut from a pre-fabricated wafer each die is attached to a wiring substrate, frame or chip carrier. Hereafter, such a composite product is referred to as “electronic module”. Such electronic module typically consists of a chip or die 50e0806aeb peoneal
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